Difference between revisions of "Rock3/hardware/revision"
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== Model A vs. Model B == | == Model A vs. Model B == | ||
− | + | {| class="wikitable" | |
− | + | |- | |
− | + | ! Model | |
− | + | ! RAM | |
− | + | ! Ethernet | |
− | + | ! WiFi/BT | |
+ | ! eDP | ||
+ | ! LVDS | ||
+ | ! Cellular 4G/5G | ||
+ | ! Heatsink | ||
+ | ! Size | ||
+ | |- | ||
+ | | ROCK 3 Model A | ||
+ | | 2GB, 4GB or 8GB | ||
+ | | 1x GbE | ||
+ | | N/A, via M.2 | ||
+ | | N/A | ||
+ | | N/A | ||
+ | | N/A | ||
+ | | Small attach to CPU, with fan | ||
+ | | 85 * 56 mm | ||
+ | |- | ||
+ | | ROCK 3 Model B | ||
+ | | 4GB or 8GB | ||
+ | | 2x GbE | ||
+ | | WiFi 6/BT 5 | ||
+ | | Support | ||
+ | | Support | ||
+ | | Support | ||
+ | | Big with mount, with fan | ||
+ | | 100 * 75 mm | ||
+ | |} | ||
==Change lists== | ==Change lists== | ||
=== Model A === | === Model A === | ||
− | === v1.1 === | + | ==== v1.1 ==== |
- First public version, only few are made, some early developers receive samples | - First public version, only few are made, some early developers receive samples | ||
− | === v1.2 === | + | ==== v1.2 ==== |
Changes based on v1.1 with community suggestions: | Changes based on v1.1 with community suggestions: | ||
Line 27: | Line 53: | ||
* Change M.2 E key mounting to standard M.2 screw | * Change M.2 E key mounting to standard M.2 screw | ||
* Rotate the logo to align with the CPU silkscreen and WiFi cards | * Rotate the logo to align with the CPU silkscreen and WiFi cards | ||
+ | |||
+ | ==== v1.3 ==== | ||
+ | Changes based on v1.2 with manufacturing improvement: | ||
+ | * change resistor 240R footprint from 0402 to 0201 | ||
+ | * change capacitor 2.2uF, 22uF footprint from 0805 to 0603 | ||
+ | * headphone jack footprint improvement | ||
+ | * Q3 MOS WNM2021-3/TR SOT-323 change to triode 3904 SOT23-3 | ||
=== Model B === | === Model B === |
Latest revision as of 01:04, 19 January 2022
Radxa ROCK 3 > Hardware > Hardware Revision
There are three models of ROCK 3, model A and model B. Model A is a stripped down version of model B in smaller size and less features. The differences are:
Contents
Model A vs. Model B
Model | RAM | Ethernet | WiFi/BT | eDP | LVDS | Cellular 4G/5G | Heatsink | Size |
---|---|---|---|---|---|---|---|---|
ROCK 3 Model A | 2GB, 4GB or 8GB | 1x GbE | N/A, via M.2 | N/A | N/A | N/A | Small attach to CPU, with fan | 85 * 56 mm |
ROCK 3 Model B | 4GB or 8GB | 2x GbE | WiFi 6/BT 5 | Support | Support | Support | Big with mount, with fan | 100 * 75 mm |
Change lists
Model A
v1.1
- First public version, only few are made, some early developers receive samples
v1.2
Changes based on v1.1 with community suggestions:
- Add a USB hub for M.2 E Key USB for BT
- Add a PWM fan connector
- Add silkscreen for eMMC module
- Change M.2 E key mounting to standard M.2 screw
- Rotate the logo to align with the CPU silkscreen and WiFi cards
v1.3
Changes based on v1.2 with manufacturing improvement:
- change resistor 240R footprint from 0402 to 0201
- change capacitor 2.2uF, 22uF footprint from 0805 to 0603
- headphone jack footprint improvement
- Q3 MOS WNM2021-3/TR SOT-323 change to triode 3904 SOT23-3