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Difference between revisions of "Rock3/hardware/revision"

 
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== Model A vs. Model B ==
 
== Model A vs. Model B ==
* Model A doesn't have on board WiFi/BT, Model B has on board WiFi6.
+
{| class="wikitable"
* Model B support eDP/LVDS/MIPI, Model A support MIPI only.
+
|-
* Model B support Cellular connectivity including 4G&5G, Model A doesn't support
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! Model
* Model B support bigger heatsink with mounting holes, Model A support smaller heatsink attach to CPU only, both support PWM controlled fan.
+
! RAM
* Model B size 100*75mm, Model A size 85*56mm
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! Ethernet
* Model B has two GbE, model A has only one.
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! WiFi/BT
 +
! eDP
 +
! LVDS
 +
! Cellular 4G/5G
 +
! Heatsink
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! Size
 +
|-
 +
| ROCK 3 Model A
 +
| 2GB, 4GB or 8GB
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| 1x GbE
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| N/A, via M.2
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| N/A
 +
| N/A
 +
| N/A
 +
| Small attach to CPU, with fan
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| 85 * 56 mm
 +
|-
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| ROCK 3 Model B
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| 4GB or 8GB
 +
| 2x GbE
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| WiFi 6/BT 5
 +
| Support
 +
| Support
 +
| Support
 +
| Big with mount, with fan
 +
| 100 * 75 mm
 +
|}
  
 
==Change lists==
 
==Change lists==
 
=== Model A ===
 
=== Model A ===
=== v1.1 ===
+
==== v1.1 ====
 
- First public version, only few are made, some early developers receive samples
 
- First public version, only few are made, some early developers receive samples
  
=== v1.2 ===
+
==== v1.2 ====
 
Changes based on v1.1 with community suggestions:
 
Changes based on v1.1 with community suggestions:
  
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* Change M.2 E key mounting to standard M.2 screw
 
* Change M.2 E key mounting to standard M.2 screw
 
* Rotate the logo to align with the CPU silkscreen and WiFi cards
 
* Rotate the logo to align with the CPU silkscreen and WiFi cards
 +
 +
==== v1.3 ====
 +
Changes based on v1.2 with manufacturing improvement:
 +
* change resistor 240R footprint from 0402 to 0201
 +
* change capacitor 2.2uF, 22uF footprint from 0805 to 0603
 +
* headphone jack footprint improvement
 +
* Q3 MOS WNM2021-3/TR SOT-323 change to triode 3904 SOT23-3
  
  
 
=== Model B ===
 
=== Model B ===

Latest revision as of 01:04, 19 January 2022

    Radxa ROCK 3 >  Hardware >  Hardware Revision

There are three models of ROCK 3, model A and model B. Model A is a stripped down version of model B in smaller size and less features. The differences are:

Model A vs. Model B

Model RAM Ethernet WiFi/BT eDP LVDS Cellular 4G/5G Heatsink Size
ROCK 3 Model A 2GB, 4GB or 8GB 1x GbE N/A, via M.2 N/A N/A N/A Small attach to CPU, with fan 85 * 56 mm
ROCK 3 Model B 4GB or 8GB 2x GbE WiFi 6/BT 5 Support Support Support Big with mount, with fan 100 * 75 mm

Change lists

Model A

v1.1

- First public version, only few are made, some early developers receive samples

v1.2

Changes based on v1.1 with community suggestions:

  • Add a USB hub for M.2 E Key USB for BT
  • Add a PWM fan connector
  • Add silkscreen for eMMC module
  • Change M.2 E key mounting to standard M.2 screw
  • Rotate the logo to align with the CPU silkscreen and WiFi cards

v1.3

Changes based on v1.2 with manufacturing improvement:

  • change resistor 240R footprint from 0402 to 0201
  • change capacitor 2.2uF, 22uF footprint from 0805 to 0603
  • headphone jack footprint improvement
  • Q3 MOS WNM2021-3/TR SOT-323 change to triode 3904 SOT23-3


Model B